TSPROF Blitz Medium F400 Diamond Plate

Diamond plates on galvanic bond provide intensive metal removing and can be used for the cutting edge with significant damage (chips, bends etc.).
Diamond plate F400 Medium is used for main sharpening operations and creating the aggressive cut.
They work much more aggresively than stones on organic or metallic bond with the same grain size. It's achieved by protruding diamond grains, whereas grais in organic or metallic bond are suck in the binder and mixed with it. The grain concentration in a layer is 100%. Although it should be noticed that these stones will give in to other stones in duration of work because of thin coating, which will actively remove while sharpening.
You also should remember, that by working with soft steels (up to 58 HRC) these diamond stones will work out faster than by working with harder steels.
Diamond stones on galvanic bond don't require preparing for work (levelling,  etc.).

Abrasive dimensions: 4х25х150 mm
Gritness: 400 grit (FEPA-F)